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HDI Printed Circuit Board PCB

Specifications

HDI Printed Circuit Board PCB 
1. Resin-plugging PCB 
2. Impedance:5 single-ended 50ohm,differential 100ohm 

• General Manufacturing Capability

Category Description Capability
File Formats Gerber files- preferred 274-X,274-D,DPF,ODB++
Drill file X & Y coordinates, with tool sizes included
Size Max. finished dimensions 580mm x 800mm ¨C Single/ Double-sided
550mm x 800mm ¨C Multilayer
Board Thickness Standard 1.6mm ¡À10%
Min. Single/ Double-sided:0.2mm ¡À0.1mm
4-layer:0.4mm ¡À0.1mm
6-layer:0.6mm ¡À0.1mm
8-Layer:1.0mm ¡À0.1mm
10-layer:1.0mm ¡À0.12mm
12-layer:1.2mm ¡À0.12mm
¡­
32-layer:4.0mm ¡À0.4mm and above
Max. 6.3mm ¡À10%
Bow and twist < 7/1000
Copper Outer Cu weight 1oz ~ 10oz
Weight Inner Cu wight 1/3oz ~ 6oz
Laminate Materials FR4(High TG,halogen-free),FR5,ISOLA(FR408,370HR),TEFLON,POLYIMIDE,ROGERS(RO4003,RO4350,RO4450),Aluminum plate (Single,Double-sided)
FR4 Thickness 1.6mm
High TG FR4 (170 deg C) 1.6mm
Board Cutting Max. number of layers 32
Min. thickness for inner layers (Cu thickness are excluded) 0.07mm
Drilling Min. size 0.1mm
Max. size 6.0mm 
Drill Deviation ¡À0.002¡± (0.050mm)
PTH hole tolerance ¡À0.003¡± (0.075mm)
NPTH hole tolerance ¡À0.002¡± (0.050mm)
Angle of Countersink 80¡ã,90¡ã,100¡ã,120¡ã
Plating Min. hole size 0.0008¡± 
Aspect ratio 20
Etching Trace width tolerance ¡À20%
Min. trace width / space (1oz finished Cu weight starting from 1/3oz) 0.003¡±/ 0.003¡±(0.08mm)
Min. trace width / space  (1oz finished Cu weight starting from 1/2oz) 0.004¡±/ 0.004¡±(0.1mm)
Min. trace width / space (2oz finished Cu weight) 0.005¡±/ 0.005¡±(0.127mm)
Min. trace width / space  (3oz finished Cu weight) 0.008¡±/ 0.008¡±(0.2mm)
Min. trace width / space (4oz finished Cu weight) 0.012¡±/ 0.012¡± (0.3mm)
Inner Layers Min. space from drilling to inner pattern 0.1mm
Min. space from annular ring to inner pattern 0.1mm
Layer-to-layer registration ¡À0.003¡±(0.08mm)
Solder Mask Color green,light green,matte green,white,extreme white,black,matte black,dark brown,yellow,red,blue,transparent
Min. solder mask clearance 0.003¡±
Thickness 0.0004¡±
Silkscreen Color White,black,yellow,red,blue,green
Min. trace width 0.005¡±
Min. size 0.028¡± / 0.028¡±
Electrical Test AOI  Y
Flying Probe Tester Y
Controlled Impedance Tolerance ¡À10%
Impedance tester Tektronix TDS8200
Routing End Mills Test ¡À0.15mm(0.006¡±)
CNC Tolerance ¡À0.15mm(0.006¡±)
V-Cut Depth ¡À0.1mm(0.004¡±)
V-cut angle deviation ¡À0.1mm(0.004¡±)
Semi-hole Y
Surface Finish HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon¡­
Blind and Buried Vias 3+N+3 Y
Resin,hole-filling ink,PTH Y
Others UL Cert. Y
ISO Cert. ISO9001/ISO14001/RoHS

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