FCCL - PEN Copper Clad Laminate

This series includes various types according to different copper and PEN film utilized to meet the specific needs of customers. 

Descriptions:
This series includes various types according to different copper and PEN film utilized to meet the specific needs of customers. See usual specifications as follows:

Base PEN film: 1 ~ 5mils thickness;
Copper foil: EDHD & RA copper both available, 1/2, 1.0 & 2.0 Oz thicknesses;
Adhesive: Modified epoxy adhesive, 0.5 ~ 0.8 mils;
Laminate structure: Single side & Double sides both available;

Features & Applications:
--Meet the RoHS requirement & halogen free, and pass SGS certificate.
--High bond strength and good chemical resistance.
--Excellent dimensional stability.
--Better thermal property than PET base film.

Widely used in the data communication, personal computer and automotive fields.