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Paper base Copper Clad Laminates(XPC,FR-1,FR-2 CCL)

Conventional XPC   

  HFI-1175

* Low cost with wide application

* Warpage / twist are small & stable

* Suitable for punching at 40~70¡æ

* Good even thickness

* General applications of electrical products such as remote control that doesn't have high requests.

 

Conventional FR-1 

 HFI-2175

* Warpage / twist both less than 1.0%

* High CTI 600V is available

* Suitable for punching at 40 ~ 70¡æ

* General applications of household appliances and related electronic products.

 

Silver through hole FR-1

HFI-2175

* Warpage / twist both less than 1.0%

* Superior electric property under moisture condtion

* Suitable for silver through hole

* General applications of household appliances and related electronic  products. 

 

Halogen-free FR-1

HFI-2600H

* Less odorfriendly to environment

* High CTI value 600V available

* Suitable for punching at 40 ~ 70¡æ

* Warpage / twist are small & stable

* General applications of household appliances and other electronic  products with halogen-free requests.


  Conventional FR-2

HFI-3150

* Low cost with wide applications

* Superior heat & humidity resistance

* Suitable for punching at 40 ~ 70¡æ

* Warpage / twist are small & stable

* Excellent dimensional stability

* General applications of household applianceselectrical toys and other products.

 

Halogen-free FR-2

HFI-3600H

* Less odorfriendly to environment

* High CTI 600V available

* Superior heat & humidity resistance

* Suitable for punching at 40 ~ 70¡æ

* Warpage / twist are small & stable

* General applications of household applianceselectrical toys and other products with halogen-free requests.



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